Chunping Dai

机构：University of British Columbia · ORCID：0000-0003-1800-2437

发表论文 140 篇 · 总被引 3438 次 · h-index 33

代表论文

• Bamboo industrialization in the era of Industry 5.0: an exploration of key concepts, synergies and gaps (2024 · Environment Development and Sustainability · 被引 13)
• A formaldehyde-free, high-performance soy protein-based adhesive enhanced by hyperbranched sulfuretted polyamidoamine-epichlorohydrin resin (2025 · International Journal of Biological Macromolecules · 被引 10)
• A dual resin application system for improved bamboo-wood bonding (2024 · International Journal of Adhesion and Adhesives · 被引 10)
• Drying and heat treatment of bamboo: Cell collapse and restoration (2025 · Construction and Building Materials · 被引 9)
• Evidence on the Social, Economic, and Environmental Impact of Interventions That Facilitate Bamboo Industry Development for Sustainable Livelihoods: A Systematic Map (2025 · Forests · 被引 8)
• Ultra-high elastic conductive lignin-based aerogel with topological structure for hypersensitized piezoresistive sensor, heartbeat monitoring and oil-water separation (2025 · Journal of Material Science and Technology · 被引 6)