J. Y. Li

机构：Central South University · ORCID：0000-0001-6609-2102

发表论文 3 篇 · 总被引 24 次 · h-index 3

代表论文

• Mechanical reliability of transient liquid phase bonding of Au–Sn solder with Ni(Cu) substrates (2017 · Journal of Materials Science Materials in Electronics · 被引 10)
• Retinal Organoid Models Show Heterozygous Rhodopsin Mutation Favors Endoplasmic Reticulum Stress-Induced Apoptosis in Rods (2023 · Stem Cells and Development · 被引 7)
• Effects of Co addition on shear strength and interfacial microstructure of Sn–Zn–(Co)/Ni joints (2018 · Journal of Materials Science Materials in Electronics · 被引 7)