R. C. Wang

机构：Central South University

发表论文 6 篇 · 总被引 69 次 · h-index 4

代表论文

Microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu joints during transient liquid phase bonding (2018 · Journal of Materials Science · 被引 35)
Interfacial Microstructure Evolution and Shear Behavior of Au-Sn/Ni-xCu Joints at 350°C (2016 · Journal of Electronic Materials · 被引 14)
Mechanical reliability of transient liquid phase bonding of Au–Sn solder with Ni(Cu) substrates (2017 · Journal of Materials Science Materials in Electronics · 被引 10)
Effects of Co addition on shear strength and interfacial microstructure of Sn–Zn–(Co)/Ni joints (2018 · Journal of Materials Science Materials in Electronics · 被引 7)
Failure analysis of (DIMM hole) solder void in lead free process used OSP coated PCB (2009 · 被引 2)
Microstructure evolution and shear behavior of Au–Sn/Ni–xCo (x = 20, 40, 60, and 80 at.%) joints soldered at 350 °C (2017 · Journal of Materials Science Materials in Electronics · 被引 1)