Lin Jing

机构：The Graduate Center, CUNY, City University of New York, CUNY Advanced Science Research Center · ORCID：0000-0002-1711-8238

发表论文 11 篇 · 总被引 249 次 · h-index 7

代表论文

• Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling (2025 · Nature Communications · 被引 71)
• 3D Graphene-Nanowire “Sandwich” Thermal Interface with Ultralow Resistance and Stiffness (2023 · ACS Nano · 被引 55)
• High Thermal Conductivity of Sandwich‐Structured Flexible Thermal Interface Materials (2023 · Small · 被引 52)
• Phase change plasmonic metasurface for dynamic thermal emission modulation (2024 · APL Photonics · 被引 25)
• Electrically driven thermal infrared metasurface with narrowband emission (2022 · Applied Physics Letters · 被引 18)
• Direct Measurement of Electrically Modulated Far-Field Thermal Infrared Emission and its Dynamics (2023 · Physical Review Applied · 被引 7)