Wenfeng Ding

机构：Taiwan Semiconductor Manufacturing Company (China), Nanjing University of Aeronautics and Astronautics · ORCID：0000-0001-7687-4319

发表论文 368 篇 · 总被引 11051 次 · h-index 55

代表论文

Effects of MQL on tool wear mechanisms in side milling of Ti2AlNb intermetallic alloys (2025 · Journal of Materials Research and Technology · 被引 8)
Intelligent evolution strategies for high-performance cutting tools: status, challenges, and trends (2025 · International Journal of Extreme Manufacturing · 被引 7)
Thermal analysis of ultrasonic vibration-assisted gear form grinding: Computational modeling and experimental validation (2025 · International Journal of Heat and Mass Transfer · 被引 6)
Development and performance evaluation of a non-resonant ultrasonic vibration-assisted grinding device for ultra-high-strength gears (2025 · Journal of Manufacturing Processes · 被引 5)
Design and optimization of grinding tool structures for high-performance machining of aerospace difficult-to-cut materials (2025 · Journal of Manufacturing Processes · 被引 4)
Effects of longitudinal-torsional ultrasonic vibration on the tool wear characteristics and performance in side milling of GH4169 superalloy (2025 · The International Journal of Advanced Manufacturing Technology · 被引 3)