Wenbo Bi

机构：Shandong University · ORCID：0000-0002-9808-0648

发表论文 135 篇 · 总被引 3079 次 · h-index 33

代表论文

Experimental and numerical study on heat transfer enhancement by Flow-induced vibration in pulsating flow (2022 · Applied Thermal Engineering · 被引 53)
Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing (2021 · Solar Energy · 被引 20)
Transverse forced vibration of a diamond wire under support excitations (2022 · International Journal of Mechanical Sciences · 被引 18)
Effect of anisotropy on 4H-SiC cracking behavior during diamond wire sawing (2024 · Engineering Fracture Mechanics · 被引 17)
MRF based image stitching of electroplated diamond wire saw: For improving visual inspection accuracy of manufacturing quality (2023 · Measurement · 被引 13)
Effect of capillary adhesion on fracture of photovoltaic silicon wafers during diamond wire slicing (2022 · Solar Energy · 被引 11)