Wai Sze Yip

机构：Hong Kong Polytechnic University · ORCID：0000-0003-2847-6230

发表论文 103 篇 · 总被引 1751 次 · h-index 24

代表论文

• Deep-learning-driven intelligent tool wear identification of high-precision machining with multi-scale CNN-BiLSTM-GCN (2025 · Advanced Engineering Informatics · 被引 52)
• Optimized hierarchical and network approach to discover sustainable practices for micro-machining technologies (2025 · Journal of Environmental Management · 被引 24)
• Towards understanding the machinability improvement of high-entropy alloys via ultra-precision diamond cutting technology in a magnetic field environment (2025 · Precision Engineering · 被引 11)
• Prediction of milling tool edge honing in abrasive jet machining (2025 · International Journal of Mechanical Sciences · 被引 10)
• Grindability and microstructural effect of nickel-based superalloys in magnetic field-assisted ultra-precision grinding (2025 · International Journal of Machine Tools and Manufacture · 被引 10)
• Towards understanding the deformation mechanism of high-entropy alloy after in-situ laser-assisted diamond cutting: From macro material removal features to micro atomic arrangement patterns (2025 · Journal of Materials Processing Technology · 被引 9)