Xavier F. Brun

机构：Intel (United States)

发表论文 28 篇 · 总被引 431 次 · h-index 11

代表论文

Analysis of stresses and breakage of crystalline silicon wafers during handling and transport (2009 · Solar Energy Materials and Solar Cells · 被引 142)
Modeling and Prediction of the Flow, Pressure, and Holding Force Generated by a Bernoulli Handling Device (2009 · Journal of Manufacturing Science and Engineering · 被引 53)
A Novel Design of Temporary Bond Debond Adhesive Technology for Wafer-Level Assembly (2020 · 被引 28)
Characterization of 300 mm Low Temperature SiCN PVD Films for Hybrid Bonding application (2023 · 被引 22)
3D Heterogeneous Integration with Sub-3μm Bond Pitch Chip-to-Wafer Hybrid Bonding (2024 · 被引 18)
Low temperature Direct Bonding of SiN and SiO interfaces for packaging applications (2020 · 被引 16)