Hohyung Lee

ORCID：0000-0001-5541-2756

发表论文 32 篇 · 总被引 294 次 · h-index 10

代表论文

• Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling (2018 · 被引 48)
• Investigation of Stress in MEMS Sensor Device Due to Hygroscopic and Viscoelastic Behavior of Molding Compound (2015 · IEEE Transactions on Components Packaging and Manufacturing Technology · 被引 33)
• A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method (2018 · Microelectronics Reliability · 被引 31)
• Design guideline on board-level thermomechanical reliability of 2.5D package (2020 · Microelectronics Reliability · 被引 28)
• Study on the Explosion of the Hydrogen Fuel Tank of Fuel Cell Electric Vehicles in Semi-Enclosed Spaces (2022 · Energies · 被引 27)
• Optimal Material Properties of Molding Compounds for MEMS Package (2014 · IEEE Transactions on Components Packaging and Manufacturing Technology · 被引 23)