Yuying Sui

机构：Kunming University of Science and Technology, Chinese Academy of Sciences, Shandong Provincial Hospital, Shenzhen Institutes of Advanced Technology, Institute of Mechanics, Shandong First Medical University, University of Chinese Academy of Sciences

发表论文 12 篇 · 总被引 187 次 · h-index 7

代表论文

• Organosoluble thermoplastic polyimide with improved thermal stability and UV absorption for temporary bonding and debonding in ultra-thin chip package (2022 · Polymer · 被引 42)
• Comprehensive properties study of low-temperature imidized polyimide with curing accelerators (2020 · Journal of Materials Chemistry C · 被引 36)
• Low temperature curing polyimides with covalent-boned 5-aminobenzimidazole (2021 · Polymer · 被引 32)
• NPR effect on energy absorption enhancement of star-shaped honeycomb filled shear thickening fluids under impact (2025 · Composites Part B Engineering · 被引 25)
• Low‐dielectric and low‐temperature curable fluorinated nano carbon/polyimide composites with 6‐aminoquinoline for end capping (2022 · Polymer Composites · 被引 21)
• Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO 2 /Epoxy Composites for Advanced Electronic Packaging (2025 · Advanced Engineering Materials · 被引 9)