Yew Hoong Wong

机构：University of Malaya · ORCID：0000-0003-3254-9420

发表论文 177 篇 · 总被引 3533 次 · h-index 30

代表论文

Applications and Recent Advances of Low-Temperature Multicomponent Solders in Electronic Packaging: A Review (2025 · Micromachines · 被引 14)
Advances in ZrO2 gate dielectrics: materials, optimization strategies, and electronic applications (2025 · Journal of Materials Science Materials in Electronics · 被引 12)
Advancements in copper and silver sintering as interconnect materials in electronics applications: review (2025 · Journal of Materials Science Materials in Electronics · 被引 8)
Machine learning-driven design and optimization of electronic packaging: applications and future developments (2025 · Journal of Materials Informatics · 被引 8)
Microwave hybrid joining of SAC305-Ni@Sn composite solder: Heating mechanism, mechanical reliability, and first-principles calculation (2025 · Materials Science and Engineering A · 被引 5)
Atomic-level revelation of spontaneous polarization orientation and piezoelectricity in ε -Ga2O3 (2026 · Applied Physics Letters · 被引 2)