Yongjun Huo

机构：Beijing Institute of Technology, Jiaxing University, Shenzhen Technology University, Shenzhen MSU-BIT University · ORCID：0000-0001-6367-0501

发表论文 69 篇 · 总被引 681 次 · h-index 18

代表论文

• Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics (2026 · Advanced Science · 被引 24)
• Mechanical properties and microstructure evolution of Sn–Bi-based solder joints by microalloying regulation mechanism (2024 · Journal of Materials Research and Technology · 被引 24)
• A perspective on mechanism of heat transfer and performance optimization in advanced thermal interface materials (2025 · Applied Physics Letters · 被引 20)
• The anti-electrochemical migration mechanism of Ag-based transient liquid-phase electrically conductive adhesive: Experimental and phase-field study (2025 · Applied Surface Science · 被引 16)
• Molecular Dynamics Analysis of the Solid-State Bonding Mechanism and High Strain Rate Response for (1 1 1)-Oriented Nanotwinned Silver (2025 · ACS Applied Materials & Interfaces · 被引 8)
• Study on the plasticity enhancing mechanism of silver-based solid solution for electronic packaging (2024 · Journal of Materials Research and Technology · 被引 8)